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F4BME High Frequency PCB Advanced Laminates for Microwave and RF Applications

(PCB's are custom-made products, the picture and parameters shown are just for reference)


Introduction

The F4BME High Frequency PCB series is constructed from a carefully formulated blend of fiberglass cloth, polytetrafluoroethylene (PTFE) resin, and PTFE film. This design enhances electrical performance compared to the F4B series, featuring a wider range of dielectric constants, lower dielectric loss, increased insulation resistance, and improved stability, making it a viable alternative to similar foreign products.


The F4BME and F4BM variants have the same dielectric layer but differ in copper foil combinations: F4BME uses reverse-treated foil (RTF) copper foil, providing excellent Passive Intermodulation (PIM) performance, precise line control, and reduced conductor loss. In contrast, F4BM utilizes ED copper foil for applications without PIM requirements.


By adjusting the ratio of PTFE to fiberglass cloth, both variants achieve precise control of the dielectric constant, ensuring low loss and enhanced dimensional stability. A higher dielectric constant is associated with a greater proportion of fiberglass, leading to improved dimensional stability and reduced thermal expansion.


Features & Benefits

Customizable dielectric constant (DK) options: 2.17 to 3.0
Low loss characteristics
F4BME with RTF copper foil for excellent PIM performance
Cost-effective and diverse size options
Radiation resistance and low outgassing
Commercially available with large-scale production


Laminate Models and Data Sheet

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Product Technical Parameters Product Model & Data Sheet
Product Features Test Conditions Unit F4BME217 F4BME220 F4BME233 F4BME245 F4BME255 F4BME265 F4BME275 F4BME294 F4BME300
Dielectric Constant (Typical) 10GHz / 2.17  2.2  2.33  2.45  2.55  2.65  2.75  2.94  3.0 
Dielectric Constant Tolerance / / ±0.04 ±0.04 ±0.04 ±0.05 ±0.05 ±0.05 ±0.05 ±0.06 ±0.06
Loss Tangent (Typical) 10GHz / 0.001  0.001  0.0011  0.0012  0.0013  0.0013  0.0015  0.0016  0.0017 
20GHz / 0.0014  0.0014  0.0015  0.0017  0.0018  0.0019  0.0021  0.0023  0.0025 
Dielectric Constant Temperature Coefficient -55ºC～150ºC PPM/℃ -150  -142  -130  -120  -110  -100  -92  -85  -80 
Peel Strength 1 OZ F4BM N/mm >1.8 >1.8 >1.8 >1.8 >1.8 >1.8 >1.8 >1.8 >1.8
1 OZ F4BME N/mm >1.6 >1.6 >1.6 >1.6 >1.6 >1.6 >1.6 >1.6 >1.6
Volume Resistivity Standard Condition MΩ.cm ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6
Surface Resistivity  Standard Condition MΩ ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6
Electrical Strength (Z direction) 5KW，500V/s KV/mm >23 >23 >23 >25 >25 >25 >28 >30 >30
Breakdown Voltage (XY direction) 5KW，500V/s KV >30 >30 >32 >32 >34 >34 >35 >36 >36
Coefficientof Thermal Expansion   XY direction -55 º~288ºC ppm/ºC 25, 34 25, 34 22, 30 20, 25 16, 21 14, 17 14, 16 12, 15 12, 15
Z direction -55 º~288ºC ppm/ºC 240  240  205  187  173  142  112  98  95 
Thermal Stress 260℃, 10s，3 times No delamination No delamination No delamination No delamination No delamination No delamination No delamination No delamination No delamination
Water Absorption 20±2℃, 24 hours % ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08
Density Room Temperature g/cm3 2.17  2.18  2.20  2.22  2.25  2.25  2.28  2.29  2.29 
Long-Term Operating Temperature High-Low Temperature Chamber ℃ -55～+260 -55～+260 -55～+260 -55～+260 -55～+260 -55～+260 -55～+260 -55～+260 -55～+260
Thermal Conductivity Z direction W/(M.K) 0.24  0.24  0.28  0.30  0.33  0.36  0.38  0.41  0.42 
PIM Only applicable to F4BME dBc ≤-159 ≤-159 ≤-159 ≤-159 ≤-159 ≤-159 ≤-159 ≤-159 ≤-159
Flammability / UL-94 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0
Material Composition / / PTFE, Fiberglass Cloth
F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil.


Our PCB Capability (F4BME)

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PCB Capability (F4BME) 
PCB Material: PTFE glass fiber cloth copper clad laminates
Designation                        (F4BME ) F4BME DK (10GHz) DF (10 GHz)
F4BME217 2.17±0.04 0.0010 
F4BME220 2.20±0.04 0.0010 
F4BME233 2.33±0.04 0.0011 
F4BME245 2.45±0.05 0.0012 
F4BME255 2.55±0.05 0.0013 
F4BME265 2.65±0.05 0.0013 
F4BME275 2.75±0.05 0.0015 
F4BME294 2.94±0.06 0.0016 
F4BME300 3.00±0.06 0.0017 
Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness               (or overall thickness) 0.127mm (dielectric), 0.2mm, 0.25mm, 0.5mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.5mm, 1.524mm, 1.575mm, 2.0mm, 2.5mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

A PCB and Typical Applications

Displayed on the screen is a 2-layer copper high-frequency PCB with a low DK of 2.2, utilizing F4BME material and HASL surface finish on a 3.0mm substrate.


F4BME high-frequency PCB finds applications in microwave, RF, and radar systems, as well as in phase shifters, passive components, power dividers, couplers, combiners, feed networks, phased array antennas, satellite communications, and base station antennas.


Final - F4BME series aluminum-based/copper-based boards

These F4BME series of laminates can provide aluminum-based or copper-based materials, where one side of the dielectric layer is covered with copper foil, and the other side is covered with either aluminum-based material or copper-based , serving as shielding or heat dissipation purposes.



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